Job Title

Sr. Technical Program Manager, Packaging Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a Technical Program Manager for our Advanced Packaging team. This role is pivotal in managing vendor relationships, supporting package qualification, and driving project milestones in a dynamic, innovative environment. This role is hybrid , based in Taiwan , or Toronto, ON . We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are 5-10 years of experience in electronics packaging, with a diverse background spanning multiple areas such as process, material selection, and advanced packaging technologies. Proactive problem-solver with strong organizational skills and a track record of successfully managing complex technical projects. Excellent communication skills, enabling effective collaboration with cross-functional teams and external partners. Detail-oriented, adept at prioritizing tasks, and thrive in a fast-paced, innovative environment. What We Need Vendor Management: Oversee relationships with external vendors, ensuring timely delivery of components and adherence to quality standards. Package Qualification: Support the qualification process for packaging solutions, including testing and validation to meet performance and reliability requirements. Schedule and Milestone Development: Create and maintain project schedules, defining clear milestones to drive progress and ensure on-time delivery. Meeting Documentation: Document meeting minutes accurately and follow up on action items to keep projects on track. Jira Ticket Management: Update and manage tickets in Jira to track project progress, issues, and resolutions effectively. What You Will Learn Gain in-depth knowledge of high-end AI processor advanced packaging, including the latest materials, processes, and reliability methods. Work in a dynamic, cross-functional environment, collaborating with experts in design, manufacturing, and reliability to drive innovation. Develop hands-on experience managing end-to-end package qualification, from vendor engagement to testing and validation. #J-18808-Ljbffr