Job Title

Experienced in MCAD-ECAD co-design with understanding of thermal and mechanical design considerations. Excellent working knowledge of PCB Design within Cadence Allegro PCB Design including proficiency using Constraint Manager. Experience with advanced PCB technology, including but not limited to HDI design (including microvias and blind/buried vias), EMI/EMC compliance, and flex and rigid-flex design. Strong understanding of PDN, electrical, SI/PI, and DFM/DFT/DFA design principles Developing schematic, layout for next generation data center product as a path finding TR activity.Integrate with cross-functional teams Package, PI, SI, Thermal, and Power delivery teams to optimize the next-generation product design.Familiar with SKILL, LISP, PERL, Python code or any scripting Support brings up new and existing programs for the pre-silicon including path finding and performance optimization for data center GPUs.Developed and defined system design features to align with customer requirements, ensuring a seamless integration of software and hardware components.Analyzed and evaluated system performance, preparing technical contract deliverables to document findings and recommendations.Worked effectively in a cross-functional environment, liaising with various stakeholders to ensure cohesive project execution and delivery.Executed technical tasks related to defining and managing application databases for software subsystems, enhancing system efficiency and reliability.