A leading engineering services provider in Ottawa is seeking a Microelectronic Packaging Design Engineer. This role involves defining technologies and designs for microelectronic modules, ensuring compliance, and generating product documentation. The ideal candidate has at least 5 years of experience in electronic hardware design, particularly in Wafer Level and Chip Scale Packaging. Proficiency in CAD software is essential. Strong communication skills and customer focus are highly valued. #J-18808-Ljbffr
Job Title
Microelectronic Packaging Design Engineer - End-to-End