Job Title

As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We''re a technology company that leads with our humanitydriving our business priorities alongside meaningful social, community, and societal impact. Description de Poste: Nous recherchons un ingnieur en procds d''assemblage photonique hautement motiv et rigoureux pour rejoindre notre quipe de composants photoniques, spcialise dans les procds de fabrication avancs pour les applications de tlcommunications. Vous jouerez un rle cl dans le dveloppement des procds d''assemblage de composants et systmes photoniques, tels que les metteurs-rcepteurs optiques et autres dispositifs critiques permettant les rseaux de communication haute vitesse. Vous collaborerez avec des quipes multidisciplinaires pour garantir la scalabilit, la fiabilit et la performance des produits photoniques utiliss dans les systmes de tlcommunications de pointe. Responsabilits principales: Concevoir, mettre en uvre et optimiser les procds d''assemblage, de la phase de recherche et dveloppement (R&D) jusqu'' l''introduction en production, notamment : Les procds au niveau des wafers (bumping, flip chip, amincissement et dcoupe). Le flip chip pour des interconnexions haute performance. La liaison par fils pour assurer des connexions lectriques fiables. L''alignement actif permettant d''atteindre des performances optiques idales. L''attache des puces pour un placement scuritaire des composants photoniques. Collaborer troitement avec les ingnieurs en conception, les techniciens de laboratoire, les partenaires de la chane d''approvisionnement et les fabricants sous contrat afin d''assurer une intgration fluide des nouveaux procds. Participer la slection, la qualification et la mise en service des quipements d''assemblage afin de dvelopper la capacit de production et d''assurer la scalabilit des procds. Rdiger et maintenir la documentation des procds, incluant les instructions d''assemblage, les diagrammes de process flow et les documents de contrle statistique des procds (SPC). Raliser des analyses de dfaillance et des enqutes sur les causes fondamentales des dfauts lis aux procds, tout en mettant en uvre des actions correctives pour amliorer la qualit des produits. Qualifications: Baccalaurat en gnie mcanique, gnie physique, science des matriaux, ou dans un domaine connexe. Une matrise ou un doctorat est un atout, mais pas obligatoire. Entre 0 et 5 ans d''exprience dans un milieu industriel ou de recherche connexe. Une exprience pratique des procds d''assemblage photonique, des systmes optiques ou des semi-conducteurs est fortement souhaite. Excellentes comptences analytiques et en rsolution de problmes, avec un grand souci du dtail. Solides aptitudes en communication et en collaboration, avec la capacit de travailler dans un environnement multidisciplinaire. Disponibilit pour voyager l''occasion (visites chez les fournisseurs, installation d''quipements et collaborations avec les fabricants sous contrat). Passion pour l''innovation et l''apprentissage de nouvelles technologies. Job Description Photonics Assembly Process Engineer Position Overview: We are seeking a highly motivated and detail-oriented Photonics Assembly Process Engineer to join our photonics component team, specializing on advanced manufacturing processes for telecommunications applications. You will play a key role in the development of assembly processes for photonic components and systems, such as optical transceivers and other critical devices that enable high-speed communication networks. You will collaborate with cross-functional teams to ensure the scalability, reliability, and performance of photonic products used in cutting-edge telecommunication systems. Key Responsibilities: Design, implement, and optimize assembly processes from the R&D phase through production introduction, including: Wafer-level processes (e.g., wafer bumping, bonding, thinning and singulation). Flip chip bonding for high-performance interconnects. Wire bonding for reliable electrical connections. Active alignment to achieve precise optical performance. Die bonding for secure placement and integration of photonic components. Work closely with design engineers, laboratory technologists, supply chain partners and contract manufacturers to ensure seamless integration of new processes. Support the selection, qualification, and commissioning of assembly equipment to develop production capacity and ensure process scalability. Develop and maintain process documentation, including assembly plan, process flow diagrams, and statistical process control (SPC) documentation. Perform failure analysis and root cause investigations for process-related defects, implementing corrective actions to improve product quality. Qualifications: Bachelor''s degree in Mechanical Engineering, Materials Science, Engineering Physics, or a relevant field. A Master''s degree or PhD is a plus but not required. 05 years of experience in a related industrial or research environment. Hands-on experience with photonics assembly processes, optical systems, or semiconductor packaging is highly desirable. Strong analytical and problem-solving skills with attention to details. Excellent communication and teamwork skills, with the ability to work in a cross-functional environment. Willingness to travel occasionally to support supplier visits, equipment installation and collaboration with contract manufacturers. Passion for innovation and learning new technologies. Pay Range: The salary range for this role in Quebec City is $55, 700 - $88, 900 Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available. Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission. In addition to competitive compensation, Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time. We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence. Not ready to apply? Join ourTalent Communityto get relevant job alerts straight to your inbox. At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard. Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination. Ciena is anEqual Opportunity Employer, including disability and protected veteran status. If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.