Job Title

Amkor Technology, Inc. (Nasdaq: AMKR) is the worlds largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the worlds leading semiconductor and electronics companies to bring advanced technologies to market. The companys comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com . Position Summary Amkor Technology is currently hiring an IC package Design Engineer for its Tempe, AZ location. This position requires the ability to create high-quality IC package designs and detailed engineering drawings and help sustain multiple design-related activities within the Design Center. Essential Duties and Responsibilities Design Laminate (BGA) and Wafer Level packages, determining design rules, design optimization/verification, and selecting package type for thermal, mechanical, and electrical aspects Create detailed engineering drawings with little supervision Utilize skills and experience to solve design problems and customer issues Seek out opportunities to improve and advance design technology Exercise responsibility when making design-related decisions Create and sustain effective, productive, and quality partnerships between the design team and customers Interact with Amkor Product Group & Sales teams to ensure customer requirements are met; interface with internal and external customers as required Create documentation and perform record-keeping Lead by example while learning Other duties as assigned Required Qualifications This position requires a bachelor''s degree in Electrical Engineering, Mechanical Engineering, or other relevant engineering disciplines. Demonstrated experience using CAD or equivalent software to create engineering drawings Excellent verbal and written communication skills required Demonstrates the ability to efficiently complete tasks with minimal supervision Must be self-motivated and team-oriented with the ability to meet aggressive schedules and able to work well in a team environment Preferred Qualifications Semiconductor packaging experience is a plus Experience using package design and simulation tools (Cadence APD, Cadence Sigrity, Siemens Expedition, Ansys HFSS, and CAM350) PCB design experience is a plus Working knowledge of GD&T practices is helpful SI/PI experience is a plus Location Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered. ITAR Please note: This position may require access to ITAR sensitive information. Candidate must be a U.S. citizen, permanent resident, protected individual, or be eligible to qualify for a U.S. State Department export license. Equal Opportunity Statement Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance. #J-18808-Ljbffr