A leading technology firm is seeking an industry expert in Ottawa to lead process architecture and development for next-generation optical and microelectronic solutions. The role requires deep expertise in flip-chip and wire bonding processes, with a Master's degree in a relevant engineering discipline and at least 8 years of practical experience. You will define assembly strategies, develop critical process recipes, and mentor junior engineers while working on cutting-edge technologies. A competitive salary between $145,000 and $165,000 annually is offered. #J-18808-Ljbffr
Job Title
Senior Optical Packaging & Flip-Chip Process Architect