A leading technology company in Burnaby seeks an Intermediate Package Development Engineer to manage IC package development from design to production. You will oversee package design, perform feasibility studies, and lead a team in a dynamic work environment. Candidates should have a degree in engineering and 5 years of experience with BGA and QFN package design. The role offers competitive compensation and various benefits, including health insurance and a retirement savings plan. #J-18808-Ljbffr
Job Title
Senior IC Package Design Engineer – Thermal & Reliability