A leading AI technology company is seeking a Package Design Engineer in Toronto. The ideal candidate has hands-on experience with 2.5D/3D chiplet packaging and a BS/MS in Mechanical/Electrical Engineering. Responsibilities include optimizing design methodologies and collaborating with cross-functional teams. Competitive compensation ranges from $100k - $500k depending on experience and qualifications, with a hybrid working model in place. Join a diverse team passionate about AI and innovative solutions. #J-18808-Ljbffr
Job Title
Chiplet Packaging Architect — 2.5D/3D, AI-Driven