Job Title

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate nextgeneration computing experiencesfrom AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, youll discover the real differentiator is our culture. We push the limits of innovation to solve the worlds most important challengesstriving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE We are looking for a forwardthinking candidate to drive the development and deployment of nextgeneration packaging design automation and AIassisted workflows. You will focus on accelerating the design of advanced heterogeneous integration technologies, specifically substrates, organic interposers, and bridge interconnects. AMD''''s environment is fastpaced, resultsoriented, and built upon a legion of innovators with a passion for winning technology. THE PERSON The successful candidate must be a technical innovator who can bridge the gap between physical design requirements and software automation. He or she must have a drive for solutions and an aptitude to thrive in a multitasking environment, translating complex design challenges into scriptable, scalable workflows. They should possess excellent crossfunctional collaboration skills to work between Design, EDA, and AI teams, with good executive presentation skills. Demonstrating strong technical leadership to excel in his/her work with minimum supervision and a strong interest in growing within the technical or management ladder. KEY RESPONSIBILITIES Drive the development and maintenance of automation scripts and tools for Substrate, Interposer, and Silicon Bridge design flows. Deploy AI/ML methodologies to optimize critical design stages, including autorouting, component placement, and signal integrity optimization. Collaborate with EDA vendors and internal stakeholders to define and implement nextgeneration feature roadmaps for 2.5D and 3D packaging. Lead the transition from manual design practices to ''''Agentic'''' and algorithmic design operational models. Coordinate with electrical and mechanical analysis teams to build closedloop optimization systems that feed simulation results back into design construction. Prepare & present Executive Summaries of automation ROI, efficiency gains, and tool capability advancements. Coordinate activities within/external teams to deliver critical design tapeouts and methodology milestones. Mentoring junior engineers in coding best practices and advanced packaging concepts. PREFERRED EXPERIENCE Strong knowledge of EDA packaging design tools (Cadence APD/SIP, Siemens Xpedition, or Synopsys 3DIC/Compiler). Proven track record of developing automation using Python, Tcl, SKILL, or C++. Experience with applying AI/ML frameworks (PyTorch, TensorFlow, etc.) to engineering or design problems. Familiarity with Advanced Packaging architectures (2.5D/3D, Chiplets, FanOut, Hybrid Bonding). Familiar with design verification flows (DRC/LVS) and electrical extraction concepts. Good leadership and interpersonal skills. ACADEMIC CREDENTIALS Bachelor/MS degree in Electrical Engineering, Computer Engineering, Computer Science, or related field with relevant packaging experience. Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or feebased recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or thirdparty affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMDs ''''Responsible AI Policy'''' is available here. This posting is for an existing vacancy. #J-18808-Ljbffr