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About Optalysys Optalysys is a pioneering UK and US based deeptech company developing new ways to power the future of computing. By harnessing light, we are creating advanced photonic technologies that help the worlds most demanding systems run faster and more efficiently. Our work supports breakthroughs in areas such as artificial intelligence, cybersecurity and scientific discovery. At Optalysys, were bringing together talented people who are passionate about building technology that expands what computing and humanity can achieve. We are committed to building a home for exceptional talent. About the Role Role: Principal Packaging Engineer Department: Packaging / IC Design Location: US (Hybrid / Onsite) Employment Type: Permanent, FullTime Level: IC4 Optalysys is pioneering a new generation of computing platforms for cryptography, artificial intelligence, and highperformance computing (HPC). Our Optalysys One technology leverages silicon photonics to unlock unprecedented compute performance and efficiency, enabling solutions that are not achievable with conventional electronic architectures. We are looking for a Principal Packaging Engineer to drive the development of nextgeneration heterogeneous integration and advanced packaging technologies for photonicsenabled compute systems. In this role, you will architect and deliver cuttingedge 2.5D and 3D packaging solutions that integrate silicon photonics, CMOS, and IIIV devices into scalable, manufacturable systems. You will play a critical role in building Optalysys advanced packaging capability and shaping the future of optical computing hardware. This is a highimpact role that combines system architecture, advanced packaging, photonics integration, and crossindustry collaboration with foundries and OSAT partners. Key Responsibilities Architect Next-Generation Photonic Packaging - Lead the development of 2.5D and 3D heterogeneous packaging architectures for Optalysys photonic computing platforms. - Define integration strategies for silicon photonics, CMOS, and IIIV devices, including FAU and OCI optical interfaces. - Design advanced interposers, laminates, and redistribution layers (RDL) optimized for highbandwidth photonic systems. Enable Optical Compute Systems - Develop integration solutions for copackaged optics, nearpackaged optics, and pluggable optical technologies. - Work closely with silicon photonics, AMS, CMOS, and PCB design teams to enable systemlevel integration. - Establish packaging design rules and guidelines for multidie heterogeneous systems. Model, Optimize, and Validate Advanced Packages - Perform thermal modelling, signal integrity analysis, and mechanical reliability simulations. - Evaluate packaging tradeoffs to achieve maximum performance, efficiency, and scalability. - Drive reliability testing including temperature cycling, mating cycles, and mechanical stress testing. Design for Manufacturability and Scale - Implement Design for Test (DFT) and Design for Manufacturability (DFM) methodologies. - Develop Assembly Development Kits (ADKs) and packaging design frameworks. - Define test plans for package qualification and validation. - Lead failure analysis and root cause investigations. Collaborate Across the Semiconductor Ecosystem - Partner with CMOS and silicon photonics foundries, OSAT partners, and external design houses. - Coordinate crossdisciplinary development across photonics, electronics, and packaging teams. - Maintain traceable and auditable engineering documentation throughout the product lifecycle. Build and Lead Packaging Innovation - Help establish and grow Optalysys advanced packaging capability. - Drive innovations that enable highperformance optical computing systems. - Contribute to technical strategy and roadmap for nextgeneration packaging technologies. Required Experience & Skills - MS or PhD in Electronics, Photonics, Mechanical Engineering, Materials Science, or a related field. - 1015 years of experience in semiconductor packaging and assembly. - Deep expertise in: - 2.5D / 3D packaging technologies - Heterogeneous integration - Interposers, laminates, and RDL design - Advanced semiconductor materials and packaging processes - Silicon photonics packaging and optical integration (FAU, OCI or similar) - Thermal, mechanical, and reliability modelling of advanced packages - Proven track record of delivering innovative packaging solutions in complex semiconductor systems - Excellent crossfunctional communication and collaboration skills. - Experience working with foundries, OSAT partners, and external design teams. - Familiarity with Agile development practices. Benefits We offer competitive compensation. The base salary range for this role is determined based on location, experience, educational background, and market data. Salary Range: total compensation goes beyond base salary, it also includes comprehensive health care plan, retirement savings matching program, generous time off, annual performance-based bonus, and other rewards that recognise your impact and contribution. Benefits eligibility may vary depending on your employment status and location. Optalysys recruits, employs, trains, compensates, and promotes regardless of race, religion, color, national origin, sex, disability, age, veteran status, and other protected status as required by applicable law. How to apply Please send a copy of your Resume/CV to [email protected] with a cover letter. #J-18808-Ljbffr