A pioneering technology company is seeking a Principal Packaging Engineer to lead the development of innovative packaging solutions for advanced optical computing systems. The ideal candidate will have 10-15 years of experience in semiconductor packaging and assembly, a strong background in 2.5D/3D packaging technologies, and expertise in heterogeneous integration. This role offers a hybrid work environment, competitive compensation, and numerous benefits, including performance-based bonuses and comprehensive health care plans. #J-18808-Ljbffr
Job Title
Principal Photonic Packaging Architect