Job Title

Sr. Principal Electrical Engineer - Analog IC Andover, MA or Ottawa, Canada Job Description In this impactful role, you will be responsible for circuit analysis, design, verification, and leading the development of analog integrated circuits used in nextgeneration WiFi frontend modules in Silicon, SOI, and BiCMOS technologies. Typical circuits include FET and BJT biasing circuits for Tx and Rx, lowdropout regulators (LDOs), bandgap circuits, linear and logarithmic RF detectors, overvoltage/overcurrent protection, positive and negative charge pumps, opamps/OTAs, and closedloop feedback circuits for integrated RF modules. The preferred candidate should also have mixedsignal and digital integration experience. To be successful, you should be fully capable of toplevel die development, tapeout, and product ownership, with a strong knowledge of design flow, layout parasitics, and ESD best practices. You should have demonstrated experience in driving analog design innovation and best practices throughout the product development process, and be comfortable interacting with designers from multiple sites, requiring good communication and presentation skills. Job Requirements - MS degree (minimum) with at least 12 years of experience in analog IC design using Silicon/SOI/BiCMOS process. - Strong knowledge in transistorlevel design of standard analog blocks including bandgaps, opamps, charge pumps, log detectors, regulators, precision current sources, digital drivers and I/O, basic logic synthesis. - Experience in toplevel chip integration of analog blocks and understanding of systemlevel specifications and requirements. - Comprehensive simulation skills in Cadence including PEX, device matching, stability analysis, Monte Carlo, and corner analysis. - Understanding of ESD protection, noise and crosstalk, grounding, design for yield, manufacturability and testability. - Experience in mixedsignal and digital integration. - Experience in analog layout best practices and familiarity with Cadence Virtuoso. - Understanding of device physics, transistorlevel modeling and general knowledge of IC fabrication in Silicon or CMOS processes 180nm or below. - Knowledge of packaging of integrated module IC products and packaging parasitics. - Strong communication and presentation skills and a desire to be part of a dynamic team. Pay & Benefits The typical base pay range for this role across the U.S. is currently USD$143,000$286,400 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, and work location. Skyworks offers a comprehensive benefits package that includes healthcare benefits (including a premiumfree medical plan option), a 401(k) plan with company match, an employee stock purchase plan, paid time off (vacation, sick/wellness, parental leave), and an incentive plan with potential for additional awards. Equal Opportunity Employer Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at [email protected]. 2024 Skyworks Solutions, Inc. #J-18808-Ljbffr