Job Title

Take your career to the next level at Tenstorrent as a Package Design Engineer in a hybrid role based in Toronto or Taipei. Focus on organic and advanced 2.5D/3D chiplet packaging. This role seeks a seasoned Package Design Engineer to lead the design and optimization of chiplet packaging. You will own placement and routing decisions and push for innovative design solutions through effective collaboration. Engaging cross-functionally, you''ll drive major improvements while ensuring clear engineering documentation. Key Responsibilities: Manage routing and placement of organic chiplet packages Optimize new 2.5D packaging methodologies Support verification processes including DRC and sign-off Collaborate with suppliers for improvement initiatives Create engineering documentation for technical communication Requirements: BS/MS in Mechanical/Electrical Engineering Minimum 5 years in 2.5D package layout Proven experience with FCBGA package tapeout Great teamwork and collaboration skills Proficient in automation tools like Python or TCL Bring your expertise to Tenstorrent and help shape the future of AI with advanced chiplet design. #J-18808-Ljbffr