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Job Summary:We are seeking an Experienced Intrinsic BEOL (Back End of Line) Reliability Engineer to drive the reliability engineering activities critical to ensuring the long-term performance and robustness of semiconductor devices manufactured at our world-class foundry in Dholera, Gujarat. This role is key to establishing our fab’s reputation for delivering highly reliable and quality products for advanced applications.The successful candidate will collaborate closely with device engineering, process integration, module engineering, and quality teams to develop, execute, and monitor intrinsic reliability programs, ensuring compliance with industry standards and customer requirements. Early phases will involve active participation in technology qualification and fab ramp-up, transitioning to sustaining and continuous improvement activities over time.Key Responsibilities:Intrinsic BEOL Reliability Program Development:Define, develop, and implement intrinsic reliability strategies and test plans for semiconductor process technologies for different technology nodes (sub-micron, nano nodes to FINFETs) to enable products.Well versed with to establish and drive Intrinsic Reliability stress methodologies and process qualifications for BEOL Reliability such as TDDB, EM, SM, PID, HTS, CPI (chip package Interaction) and other BEOL wear-out mechanisms for different technologies/nodes.Work with R&D, Device, and Process Integration teams to design accelerated stress tests and predictive reliability models for the above-mentioned mechanisms.Reliability Stress Testing and Monitoring:Plan, execute, and monitor intrinsic reliability tests during technology development, transfer, qualification, and production ramp.Develop/transfer test structures for each of the intrinsic reliability mechanisms and implement and validate them to use for regular/Ongoing Process/Product Reliability Monitoring (PRM/ORM) programs, post production ramp and to ensure the process/line is stable.Analyse reliability test results using statistical methods (e.g., Weibull, log-normal, Arrhenius modelling etc.,) and provide clear technical interpretations and recommendations for the intrinsic reliability mechanisms.Build, maintain, and improve the fab-wide intrinsic reliability database and reporting systems, including developing the PRM programs to review and post the data regularly to customers.Failure Analysis and Root Cause Identification:Lead or support detailed failure analysis (FA) investigations related to intrinsic reliability issues.Drive root cause analysis (RCA) and implement Corrective and Preventive Actions (CAPA) in collaboration with cross-functional teams.Standards Compliance and Continuous Improvement:Ensure compliance with JEDEC, AEC-Q100, JEITA, and other applicable industry standards for reliability testing and qualification.Develop and document Best Known Methods (BKMs) for reliability assessment and continuously improve reliability methodologies.Contribute to the establishment and certification of fab-wide Quality and Reliability Management Systems (e.g., ISO, IATF standards).Cross-functional Collaboration and Risk Management:Collaborate closely with process, device, integration, metrology, and manufacturing teams to ensure reliability is embedded across the product lifecycle.Participate in Design for Reliability (DfR) activities to proactively identify and mitigate reliability risks. Work with Process and Yield to define and develop Reliability Defect Density and to correlate with Yield Defect Density. Support customer engagements, technical audits, and reliability reporting to internal and external stakeholders.Qualifications & Experience:Experience:5-10 years of experience in semiconductor device reliability, intrinsic reliability engineering, or device physics.Solid understanding of CMOS, FinFET, HV, RF and/or power (BCD) device, PMIC technologies is highly preferred.Hands-on experience in setting up and executing intrinsic reliability stress tests and analysing time-dependent failures.Experience with fab operations and process/product qualification programs is a strong plus.Experience in handling intrinsic reliability related PCRB (Process change review), MRB (Material Review), PECN, TECN (Process/Temp. Eng. Change notices) etc.,Skills:Deep understanding of semiconductor intrinsic BEOL reliability mechanisms: EM, SM, TDDB, PID, HTS, etc.Expertise in reliability stress/testing tools and systems (e.g., Qualitau, Mira, Agilent, Keysight B1500/B1530, High Temp/Humidity chambers for EM/SM, etc.).Proficient in statistical data analysis tools (e.g., JMP, Minitab) and reliability modelling techniques, Reliability progression and regression analysis.Knowledge of JEDEC standards (JESD22, JESD47), AEC-Q100, MIL-STD guidelines, and BEOL reliability requirements for Consumer, Industrial, Automotive and Military/Defence applications.Strong analytical and problem-solving skills, with a data-driven approach.Excellent communication and technical writing skills to collaborate across teams and document findings.Ability to work in a fast-paced, dynamic environment with a proactive and ownership-driven mindset.If you are passionate about building the next generation of highly reliable and robust semiconductor processes and shaping India’s first world-class semiconductor foundry, we invite you to apply and join our pioneering journey of innovation and excellence.