Job Title

WalkIn Drive For CAD Packaging - MECH Semiconductor Domain on 12th July 2025 in Bangalore ITPL Venue Date:12th July 2025 Saturday Venue Timing : 9.30 AM -2 PM Venue Location: HCLTech , Unit-B ITPL, Aviator Building, Whitefield Road, SEZ, Whitefield, Bengaluru, Karnataka 560066 Contact Person : Katherine Sylvia ( ) Key Responsibilities: Education: Bachelor’s degree in engineering (preferably Mechanical, Manufacturing, or Industrial). Experience: Minimum of 5 years in packaging engineering, sourcing, and supplier management Job Description: Primary Responsibilities: Drawing Standards: Utilize client drawing standards, such as ASME Y14.5, for geometric dimensioning and tolerancing (GD&T) to ensure clear and consistent engineering drawings Packaging Experience: Leverage past experience in packaging design and implementation to develop innovative packaging solutions. Foam Thickness Calculation: Perform foam thickness calculations to ensure adequate protection of products during transport. Packaging Standards: Adhere to packaging standards, including ASTM and ISO, to ensure product safety and compliance Commodity Code for Packaging: Utilize appropriate commodity codes for packaging materials to ensure compliance with customs and trade regulations Material Selection: Select different materials for various packaging objectives, such as corrugated cardboard for shipping boxes, plastic for lightweight packaging, and metal for durability Pallet Material: Choose suitable pallet materials, including wood, plastic, metal, and cardboard, based on the specific requirements of the shipment Types of Corrugated Sheets: Use different types of corrugated sheets, such as single wall, double wall, and triple wall, based on the strength and protection needed Regional Pallet Sizes: Understand and apply knowledge of how pallet sizes vary by region to ensure compatibility with international shipping standards