Job Title

Job DescriptionAs a Design Technical Lead Integration Engineer in the Non-Volatile-Engineering NAND Flash design team at Micron Technology, Inc., you will be taking a leading role in full chip-level integration activities. Your responsibility will include a floorplan, signal/power planning, full-chip schematic building, and chip-level quality checks. You will work with and support the efforts of functional teams to innovate and evaluate key multi-functional features and architecture to assure outstanding memory products in terms of die size, performance, reliability, and power. In this position, you will also work with and support the efforts of groups such as Product Engineering, Test, Probe, Quality and Reliability, Process Integration, Assembly and Marketing to proactively design products to optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will actively participate in the design and quality methodology improvements across the department. You will also be responsible for assisting product engineers in post-silicon design validation, root cause analysis, and providing solutions.Additional Job DescriptionResponsibilities and Duties include, but not limited to:Contributing to the development of new NAND Flash Memory by assisting with the overall design, layout, and optimization of Memory/Logic circuitsOverseeing and managing the full chip integration activities including floorplan, power/routing placement, and optimizationModel parasitics and create behavioral modelsWork with a cross-functional team in key features and architecture evaluationWorking with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure proper manufacturability of a productProactively solicit input from Standards, CAD, modeling, and verification groups to ensure the design qualityDriving innovation into the future Memory generation with the dynamic work environment