Job Title

Location: TATA Semiconductor Assembly and Test, Jagiroad, IndiaPosition Overview:As a Process Engineer in an OSAT environment, you will play a pivotal role in developing, optimizing, and sustaining semiconductor packaging processes. You will be responsible for wire bonding, flip chip assembly, and integrated system packaging technologies, supporting both high-volume production and new product introductions (NPI). This role demands a strong technical foundation, hands-on experience with packaging equipment, and the ability to collaborate across cross-functional teams including R&D, quality, and customer engineering.Key Responsibilities:1. Process Development & Optimization- Design and implement robust packaging processes including: - Wire bonding (ball/wedge bonding, fine pitch, multi-row) - Flip chip (underfill, reflow, thermal compression bonding) - Integrated system packaging - Conduct DOE (Design of Experiments) to optimize process parameters for yield, reliability, and throughput. - Develop and maintain process documentation: SOPs, control plans, FMEAs, build sheets etc.2. Manufacturing Support- Provide real-time support to production lines to resolve process-related issues. - Monitor process KPIs such as yield, cycle time, defect rates, and equipment uptime. - Lead root cause analysis and implement corrective actions for maverick lots and customer returns.3. New Product Introduction (NPI)- Collaborate with customer engineering and R&D teams to transfer new products from prototype to mass production. - Define tooling and equipment requirements for new packages. - Execute qualification plans including reliability testing.4. Equipment & Tooling Management- Work with equipment vendors to install, calibrate, and maintain packaging tools (e.g., wire bonders, flip chip bonder, molding machines, etc.). - Drive automation and process standardization across multiple product lines.5. Quality & Compliance- Ensure compliance with customer-specific requirements, JEDEC standards, and internal quality systems. - Support internal and external audits (ISO, customer audits, etc..). - Implement SPC and GR&R to monitor and control process stability.Qualifications:- Bachelor's or Master's degree in Electronics, Mechanical, Materials Science, or related field. - 5–10 years of experience in semiconductor packaging, preferably in an OSAT environment. - Hands-on experience with wire bonding, flip chip, and SiP technologies. - Proficiency in statistical tools (Minitab, JMP), SPC, and Six Sigma methodologies. - Strong analytical and problem-solving skills. - Excellent communication skills; ability to work in a multicultural, fast-paced environment.Preferred Skills:- Experience with QFN, BGA, WLCSP, and other packages. - Familiarity with substrate design, thermal modeling, and mechanical stress analysis. - Knowledge of cleanroom protocols, ESD handling.