Job Title

Roles:Manufacturing Lead- OSAT Packaging & Test Experience:5-15 Yrs Location:Jagiroad, Assam.Education Qualification:Bachelor’s or Master’s degree in Electronics, Mechanical, Manufacturing Engineering.Job Description Experienced in manufacturing operations for wire bond, flip chip, and integrated system packaging and Testing of High Volume OSAT Semiconductor Manufacturing. To Planning & execution of the Targeted manufacturing Volumes. Ensure process stability, yield optimization, and cycle time reduction across packaging and test lines Manage daily OSAT interactions for issue resolution, performance tracking, and continuous improvement Support NPI and technology transfers with equipment, materials, and process alignment Conduct root cause analysis and implement corrective actions for process deviations Collaborate with design, test, substrate, and reliability teams for seamless product flow Maintain process documentation, control plans, and operator training programs Monitor KPIs and lead initiatives for cost, quality, and delivery improvements Oversee audits and ensure adherence to safety and regulatory requirements