Job Title

Roles: Manufacturing Lead- OSAT Packaging & Test Experience: 5-15 Yrs Location: Jagiroad, Assam. Education Qualification: Bachelor’s or Master’s degree in Electronics, Mechanical, Manufacturing Engineering. Job Description - Experienced in manufacturing operations for wire bond, flip chip, and integrated system packaging and Testing of High Volume OSAT Semiconductor Manufacturing. - To Planning & execution of the Targeted manufacturing Volumes. - Ensure process stability, yield optimization, and cycle time reduction across packaging and test lines - Manage daily OSAT interactions for issue resolution, performance tracking, and continuous improvement - Support NPI and technology transfers with equipment, materials, and process alignment - Conduct root cause analysis and implement corrective actions for process deviations - Collaborate with design, test, substrate, and reliability teams for seamless product flow - Maintain process documentation, control plans, and operator training programs - Monitor KPIs and lead initiatives for cost, quality, and delivery improvements - Oversee audits and ensure adherence to safety and regulatory requirements