Job Title

Roles & Responsibilities:· Perform thermal, stress, warpage, electrical simulations post package designing to meet product data requirements based on customer specifications.· Knowledge of electrical and package simulation in relation to substrate design and data analysis.· Numerical modeling of the stress and deformation of component packages to provide comprehensive understanding of chip-package interaction.· Deep understanding of packaging materials and their mechanical behaviors.· Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a plus.Requirements:· Bachelor or Master Degree in Electrical, Mechanical, or Materials Science Engineering.· Good understanding of Advanced Packaging architecture and semiconductor packaging process flow.· Handson experience in using package simulations software tools & FEM tools such as Celsius Thermal Solver / Clarity IC Package Extraction Suite / Celsius EC Solver / Ansys Icepak / Ansys HFSS / Ansys Mechanical/ Moldex to perform signal and power integrity (SIPI) optimization, Thermal, Stress & Warpage simulations.· Knowledge on Packaging Assembly Process (Back Grinding, Dicing, Die Attach, Wire Bonding, Molding, P&P, Ball Attach, Trim & Form, Singulation).· Ability to work well in a cross-functional environment on challenging projects.· Experience in package design or coordination with package design & layout design teams.· Minimum 5 years of experience in semiconductor package simulations.· Able to perform independent research and development work.· Excellent written and verbal communication skills with ability to present ideas, design concepts, data and plan with high confidence at team meetings.