Job Title

An NPI Manager in an OSAT (Outsourced Semiconductor Assembly & Test) factory is responsible for managing the introduction of new semiconductor products from development to high-volume manufacturing. This role ensures smooth product qualification, engineering readiness, and production ramp-up while coordinating across cross-functional teams, including customers, engineering, operations, and supply chain.Responsibilities1. NPI Project Management & Execution• Lead end-to-end NPI programs, from customer engagement to mass production ramp.• Define NPI project milestones, timelines, and deliverables in alignment with customer expectations.• Ensure DFM (Design for Manufacturability) and DFx (Design for Excellence) principles are applied early in the development phase.• Manage multiple concurrent product qualifications and engineering builds (EVT, DVT, PVT) across OSAT sites.2. Cross-Functional Coordination• Serve as the primary interface between customers and OSAT manufacturing teams for NPI activities.• Work closely with R&D, process engineering, quality, planning, and procurement teams to resolve technical and operational challenges.• Align with test engineering and assembly engineering teams to optimize test flow, package assembly processes, and yield improvement strategies.• Ensure smooth handover from NPI to volume production with stable yields and optimized cost.3. Product & Process Qualification• Drive product and package qualification (JEDEC, AEC-Q100 for automotive, etc.) in collaboration with quality and reliability teams.• Review FA (Failure Analysis), DOE (Design of Experiments), and yield analysis results to optimize process windows.• Ensure compliance with customer and industry standards (e.g., IPC, ISO9001, IATF 16949 for automotive applications).4. Manufacturing Readiness & Yield Optimization• Oversee the first article builds, engineering samples, and production ramp readiness.• Work with industrial engineering and operations to ensure factory capacity, tool readiness, and process stability.• Identify and mitigate risks related to yield excursions, process variation, and supply chain disruptions.5. Cost & Efficiency Improvement• Drive cost-effective NPI execution, ensuring BOM (Bill of Materials), cycle time, and process costs are optimized before volume production.• Identify opportunities for cycle time reduction, material cost savings, and process automation.• Ensure smooth transition from NPI to high-volume manufacturing with minimal yield loss and rework. Experience in OSAT, IDM, or semiconductor supply chain environments.Essential Attributes• Strong understanding of advanced packaging technologies (FCBGA, WLCSP, SiP, 2.5D/3D ICs, automotive, or high-reliability applications).Technical Skills:• Project Management: Expertise in Agile, PMP, or Six Sigma methodologies for NPI execution.• Manufacturing & Process Engineering.• Experience with flip-chip, wire bonding, die attach, molding, and test process flows.Qualifications- Minimum of Bachelor’s or Master’s degree in Engineering (Electronics, Mechanical, Industrial, or Manufacturing) or a related technical field.Desired Experience Level- Minimum of 15+ years of experience in semiconductor packaging, assembly, or test, with at least 3 years in an NPI leadership role.