Job Title

Key Responsibilities Design and develop mechanical components and subsystems for semiconductor manufacturing equipment. Perform engineering analysis using Strength of Materials, Fluid Mechanics, Heat Transfer, and Mass Transfer principles. Conduct simulations and validations using tools like Ansys Workbench. Create and review engineering drawings, GD&T, BOMs, and MBD models. Collaborate with cross-functional teams for concept design reviews, detailing, approvals, and releases. Support integration of mechanical designs into semiconductor equipment processes. Apply knowledge of material selection, sheet metal design, routing of gas lines/hoses, and advanced manufacturing techniques (e.g., 3D printing). Document design processes and maintain compliance with organizational standards. Required Skills CAD Tools: Siemens NX, CATIA V5, Fusion 360. PLM Tools: Siemens Teamcenter. Simulation Tools: Ansys Workbench (Structural & Thermal). Strong knowledge of GD&T, MBD, and manufacturing processes. Experience in semiconductor equipment design, integration, and process knowledge preferred. Excellent problem-solving and analytical skills. Strong communication and teamwork abilities. Education Bachelor’s degree in Mechanical Engineering (B.Tech or equivalent). Strong academic background with demonstrated technical excellence.