Job Title

An NPI Manager in an OSAT (Outsourced Semiconductor Assembly & Test) factory is responsible for managing the introduction of new semiconductor products from development to high-volume manufacturing. This role ensures smooth product qualification, engineering readiness, and production ramp-up while coordinating across cross-functional teams, including customers, engineering, operations, and supply chain.Responsibilities1.NPI Project Management & Execution• Lead end-to-end NPI programs, from customer engagement to mass production ramp. • Define NPI project milestones, timelines, and deliverables in alignment with customer expectations. • Ensure DFM (Design for Manufacturability) and DFx (Design for Excellence) principles are applied early in the development phase. • Manage multiple concurrent product qualifications and engineering builds (EVT, DVT, PVT) across OSAT sites.2.Cross-Functional Coordination• Serve as the primary interface between customers and OSAT manufacturing teams for NPI activities. • Work closely with R&D, process engineering, quality, planning, and procurement teams to resolve technical and operational challenges. • Align with test engineering and assembly engineering teams to optimize test flow, package assembly processes, and yield improvement strategies. • Ensure smooth handover from NPI to volume production with stable yields and optimized cost.3. Product & Process Qualification• Drive product and package qualification (JEDEC, AEC-Q100 for automotive, etc.) in collaboration with quality and reliability teams. • Review FA (Failure Analysis), DOE (Design of Experiments), and yield analysis results to optimize process windows. • Ensure compliance with customer and industry standards (e.g., IPC, ISO9001, IATF 16949 for automotive applications).4. Manufacturing Readiness & Yield Optimization• Oversee the first article builds, engineering samples, and production ramp readiness. • Work with industrial engineering and operations to ensure factory capacity, tool readiness, and process stability. • Identify and mitigate risks related to yield excursions, process variation, and supply chain disruptions.5. Cost & Efficiency Improvement• Drive cost-effective NPI execution, ensuring BOM (Bill of Materials), cycle time, and process costs are optimized before volume production. • Identify opportunities for cycle time reduction, material cost savings, and process automation. • Ensure smooth transition from NPI to high-volume manufacturing with minimal yield loss and rework. Experience in OSAT, IDM, or semiconductor supply chain environments.Essential Attributes• Strong understanding of advanced packaging technologies (FCBGA, WLCSP, SiP, 2.5D/3D ICs, automotive, or high-reliability applications).Technical Skills: • Project Management: Expertise in Agile, PMP, or Six Sigma methodologies for NPI execution. • Manufacturing & Process Engineering. • Experience with flip-chip, wire bonding, die attach, molding, and test process flows.Qualifications Minimum of Bachelor’s or Master’s degree in Engineering (Electronics, Mechanical, Industrial, or Manufacturing) or a related technical field.Desired Experience Level Minimum of 15+ years of experience in semiconductor packaging, assembly, or test, with at least 3 years in an NPI leadership role.