Job Title

Roles & Responsibilities:· Perform thermal, stress, warpage, electrical simulations post package designing to meet product data requirements based on customer specifications. · Knowledge of electrical and package simulation in relation to substrate design and data analysis. · Numerical modeling of the stress and deformation of component packages to provide comprehensive understanding of chip-package interaction. · Deep understanding of packaging materials and their mechanical behaviors. · Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a plus.Requirements: · Bachelor or Master Degree in Electrical, Mechanical, or Materials Science Engineering. · Good understanding of Advanced Packaging architecture and semiconductor packaging process flow. · Handson experience in using package simulations software tools & FEM tools such as Celsius Thermal Solver / Clarity IC Package Extraction Suite / Celsius EC Solver / Ansys Icepak / Ansys HFSS / Ansys Mechanical/ Moldex to perform signal and power integrity (SIPI) optimization, Thermal, Stress & Warpage simulations. · Knowledge on Packaging Assembly Process (Back Grinding, Dicing, Die Attach, Wire Bonding, Molding, P&P, Ball Attach, Trim & Form, Singulation). · Ability to work well in a cross-functional environment on challenging projects. · Experience in package design or coordination with package design & layout design teams. · Minimum 5 years of experience in semiconductor package simulations. · Able to perform independent research and development work. · Excellent written and verbal communication skills with ability to present ideas, design concepts, data and plan with high confidence at team meetings.