Job Title

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components. Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence. Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’ Role Overview The Program Manager – OSAT is responsible for leading large, complex customer programs from concept through high-volume manufacturing. This role serves as the single point of accountability for program execution—integrating customer requirements, engineering development, supply chain, and factory operations to ensure on-time, on-cost, and on-quality delivery. A major focus of this position is operations readiness for new products (NPI to HVM transition), including capacity planning, qualification, ramp management, and alignment of cross-functional teams within an outsourced semiconductor assembly and test environment. Key Responsibilities Program Leadership & Execution - Own end-to-end execution of multiple customer programs within the OSAT business unit. - Act as the primary interface between customers and internal organizations (Technology Development, Factory NPI and Process Engineering, Operations/Manufacturing, Quality, Supply Chain, and Finance). - Develop and maintain integrated program schedules, milestones, and deliverables. - Drive structured program governance: stage gates, risk reviews, and executive reporting. - Manage program financials including cost optimization models, margins, and change management. Customer Engagement - Lead customer technical and business reviews, ensuring alignment on scope, schedule, and performance. - Translate customer requirements into actionable internal plans. - Manage customer escalations and ensure rapid issue resolution. - Support commercial teams in RFQs, SOWs, and new business opportunities. Operations Readiness & NPI - Lead NPI to HVM transition activities including: - Factory readiness (equipment, capacity, tooling, materials) - Qualification planning (DOE, reliability, process validation) - Yield ramp strategies and learning cycles - Coordinate process development, product engineering, and manufacturing teams. - Ensure BOM, process flows, test programs, and quality controls are production-ready. Cross-Functional Coordination - Chair core team meetings and drive accountability across functions. - Manage risk registers, mitigation plans, and contingency strategies. - Partner with Industrial Engineering on line design, cycle time, and capacity modeling. - Align with Quality on customer qualifications, audits, and compliance. Continuous Improvement - Establish program management best practices, KPIs, and dashboards. - Drive lessons-learned and standardization across programs. - Support digitalization of program tracking and factory execution. Required Qualifications - Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, Industrial) or related field. - 8+ years of experience in semiconductor manufacturing, OSAT, or advanced packaging. - 5+ years in program/project management with direct customer ownership. - Proven experience with: - New Product Introduction (NPI) and HVM ramp - Assembly & Test processes (wire bond, flip chip, WLCSP, BGA, SiP, etc.) - Semiconductor quality systems (APQP, FMEA, Control Plans, 8D) - Strong knowledge of: - Manufacturing operations, capacity planning, and yield management - Supply chain coordination and material readiness - Cost modeling and program financial management - Excellent stakeholder management and communication skills. - Ability to influence cross-functional teams without direct authority. Preferred Qualifications - Master’s degree in Engineering, Operations, or MBA. - Experience working directly in an OSAT or IDM ATM environment. - PMP / PgMP / PRINCE2 certification. - Hands-on background in: - Package development and reliability qualification - Test engineering and product bring-up - Factory automation and MES systems - Experience with Tier-1 global customers in mobile, automotive, HPC, or networking. - Six Sigma Green/Black Belt certification. Key Competencies - Customer-centric mindset - Structured problem solving - Executive communication - Risk & change management - Technical depth with business acumen - High sense of ownership and urgency - Cross-cultural collaboration Success Metrics - On-time program milestone achievement - Yield and quality targets at ramp - Customer satisfaction scores - Cost and margin adherence - Effective NPI → HVM transitions - Zero major launch escapes