Job Title

Responsibilities Lead the Development of Advanced PCBA / SI Mfg capabilities in the Vietnam sites. Collaborate and interact with customer technical team and Foxconn R&D to co‑develop tests, vehicle technical specifications, checklists, reliability testing, DFM, and processes for new assembly and rework technology, component packaging and/or process material. Foster strong and collaborative relationships with clients and internal cross‑functional teams. Lead the Mfg technical team and work in the labs at Vietnam and global labs to perform all process and reliability evaluations regularly. Support Foxconn central and other sites and business units to share and develop new Advanced Mfg capabilities. Develop and mentor leaders to possess good people skills and to be well‑rounded, high‑potential technical professionals. Requirements Bachelor’s or Master’s degree in Engineering, Material Science, Statistics, or related fields. Minimum of 10 years of Mfg Engineering and Process/Technology Development experience for PCBA and SI, with at least 5 years in a management position. At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM) environment, with a proven record. Knowledge and experience of PCBA with large‑size BGA (> 80 mm x 80 mm), co‑packaged optics, thermal compression bonding, high‑speed connectors/flying cable, and liquid cooling are preferable. Strong English communication skills (listening, speaking, reading, and writing) and excellent interpersonal skills. Ability to lead projects from beginning to end and drive initiatives with a global team. Ability to work under pressure. Work location is in Mexico. #J-18808-Ljbffr