Job Title

AtKEENFINITY, we are a globally leading provider ofinnovative and professionalsecurity and communication solutions. With over 4,200 employees in over 50 countries worldwide, our ambition is clear: we offer more than just technology – we secure, connect, and amplify the moments that matter in life.Next to our passion for technology we’re very passionate about our work environment. Based on values such as trust, appreciation, and accountability we all work together to shape the future – boldly, customer-focused and with a strong team spirit.MISSION We are looking for a highly skilledAssembly Process Engineer specialized in Package-on-Package (PoP) and Underfill technologiesto drive advanced SMT manufacturing processes at our Hermosillo site.In this role, you will lead thedevelopment, optimization, and scaling of complex assembly solutionsfor high-density electronic products, ensuring precision, reliability, and process excellence.RESPONSIBILITIES: PoP (Package-on-Package) Process Development Develop and maintainflux/paste dipping processes,optimizing transfer height and consistency. Fine-tunehigh-precision placement parameters(X, Y, θ) to ensure accurate top-package alignment. Analyze and mitigatecomponent warpageduring reflow to prevent HiP or open joint defects.Underfill & Encapsulation Optimizedispensing parameters(needle selection, pressure, speed) for CUF or jetting processes. Improveflow dynamics,ensuring full coverage with zero voids or overflow. Evaluate and selectunderfill materials, considering Tg, CTE, and mechanical properties for long-term reliability.Continuous Improvement & Quality ExecuteDesign of Experiments (DOE)to validate materials and process parameters Leadroot cause analysisusing tools such as cross-sectioning, CSAM, and X-ray Develop and maintainSOPs, PFMEAs, and Control Plansfor PoP and Underfill processes.What Your Profile Should Look Like: We're looking for a hands-on-engineer with strong technical depth and a passion for advanced manufacturing technologies. Bachelor's degree inMechanical, Mechatronics, Materials Science, Chemical Engineering, or related. 3+ years of experiencein SMT assembly, specifically with PoP and automated dispensing systems. Experience with equipment such asNordson ASYMTEK, Camalot,or similar.Technical Expertise: Strong knowledge ofthermal profiling(KIC/ECD) Solid understanding ofsolder paste chemistry and underfill rheology. Experience withAOI and 3D X-ray inspection systems. Familiarity withhigh-density / fine pitch assemblies.Languages: Professional fluency inEnglish.Nice to Have: Experience withfine pitch (≤0.4mm)assemblies. Knowledge ofJ-STD and IPC-A-610 standards. Six Sigma Green or Black Beltcertification.What set us apart?We design and manufacture our solutions in our own facilities across Europe, the Americas, and Asia, ensuring quality and innovation at every stage. In addition to our own products, we also offer contract manufacturing services, helping other companies bring their technology to life.Join a company that offers competitive benefits, flexibility, and a people-centered culture. Your next career move starts here.#GoingBeyond with KEENFINITY