Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab based tests and participating in the design and execution of reliability tests will be an important part of the role.If you want to know about the requirements for this role, read on for all the relevant information.Required skills for the Graduate MEMS Packaging Engineer will include:Strong grasp of fundamental engineering principals (DOE, basic statistics)Problem solving mind-setExposure to semiconductor packaging, MEMS, or RF technologies beneficialBachelors degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.Please contact Rachel Anderson for further details.
Job Title
Graduate MEMS Packaging Engineer