A pioneering tech company based in the US is seeking a Principal Packaging Engineer to drive the development of next-generation packaging technologies for photonic systems. You will lead the creation of innovative packaging solutions and conduct advanced modelling. The ideal candidate will have 10-15 years of semiconductor packaging experience and a relevant MS or PhD. This role offers a competitive salary with a strong benefits package and the potential for hybrid or onsite work. #J-18808-Ljbffr
Job Title
Principal Photonic Packaging Architect