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Apply online and email charles@ cc resume@ .If you are interested in applying for this job, please make sure you meet the following requirements as listed below.Senior Staff Packaging Engineer Job DescriptionResponsible for defining substrate/package design rules, process flow and material set for new automotive power module packagesDrive alignment between module substrate (PCB) design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modulesDevelop new assembly technologies, run process DOE's, to define process windows for new package developmentDrive reliability testing and qualification of new automotive module packages in conjunction with the reliability groupWork closely with offshore assembly and substrate partners to develop new processesWork closely with IC design teams to define package design rules and define packages to meet their requirementsCollaborate with multi-functional teams within Power Integrations for successful development, qualification and production ramp of new module products· Job Requirements:BS Degree in Electrical Engineering, Mechanical Engineering, Material Science.Minimum experience 12 years in semiconductor packaging technology.Experience leaded multi-die packages.Understanding of organic laminate technologies manufacturing and supplier capabilities.Experience in SMT or passive integrated package assembly is a plus.Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation. (Flip Chip is a plus)Experience with package substrate design rules, tools (including AutoCAD).Knowledge of AEQ Automotive reliability requirements.Knowledge of APQP automotive development processKnowledge of JEDEC/IPC design standards.Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout a plus.Travel to Asia to attend technology reviews and resolve subcon/supplier issuesPay range: up to $170K annual base salary, commensurate with experience